Visit DataSplice in Booth 704 at Interconnect

DataSplice will be showcasing the latest in Maximo Mobile, GIS and Inspection interfaces at IBM Interconnect, February 22-27, 2015, and invite you to visit us in booth 704.

With over 20,000 attendees including industry-renowned speakers, IBM Interconnect is the largest event of its kind. It features technology leadership sessions, industry-focused breakouts, and technical skill-building workshops. Network with colleagues, participate in hands-on labs, and attend the Solution Expo.