Visit DataSplice in Booth 704 at Interconnect

DataSplice will be showcasing the latest in Maximo Mobile, GIS and Inspection interfaces at IBM Interconnect, February 22-27, 2015, and invite you to visit us in booth 704.

With over 20,000 attendees including industry-renowned speakers, IBM Interconnect is the largest event of its kind. It features technology leadership sessions, industry-focused breakouts, and technical skill-building workshops. Network with colleagues, participate in hands-on labs, and attend the Solution Expo.

IBM Pulse is now IBM Interconnect

IBM Pulse, the annual conference attended by IBM Tivoli, and Maximo users, has merged with two other shows to become IBM Interconnect 2015. The event will be held February 22-26 at the Mandalay Bay and MGM Grand. DataSplice is pleased to announce that they will be a Silver Sponsor at InterConnect 2015. InterConnect sessions will demonstrate how organizations use IBM products and solutions embodying the full lifecycle . Three extraordinary conferences – INNOVATE, IMPACT & PULSE — are connected together providing unprecedented networking, education and deep-dive technical certification.